"TUTORIAL 59: Lower temperature lead-free flip chip," FlipChips.com , January, 2006.
"TUTORIAL 58: Nanosoldering electronic components at room temperature," FlipChips.com , December, 2005.
"A Bumpy Road for Solder Bumping," Advanced Packaging,
November, 2005, page 36.
"C4NP Solder Bumping," Advanced Packaging,
November, 2005, pages 16-20.
"TUTORIAL 56: Injection Molding Solder Bumps,"
FlipChips.com , October, 2005.
"Discovering Gold as a Lead-Free Substitute,"
Advanced Packaging, October, 2005, page 36.
"TUTORIAL 55: The Promise of C4NP,"
FlipChips.com , September, 2005.
"A Primer on Flip Chip," Smart Card News,
July, 2005, page 16.
"Flip Chip Manufactuing: A New Wave for Smart Cards,"
Regarding ID, Summer 2005, pages 18-19.
"An Innovative Approach to Lead-Free DCA,"(co-author)
IMAPS Flip Chip Workshop,Austin, Texas, June, 2005.
"TUTORIAL 52: New Generation Nano-Imprint Lithography," FlipChips.com , May, 2005.
"TUTORIAL 51: Solder Bumping Single Die,"
FlipChips.com , April, 2005.
"TUTORIAL 50: Gold Stud Bump Update,"
FlipChips.com , March, 2005.
"TUTORIAL 49: Wafer-Level Nano-Optics,"
FlipChips.com ,February, 2005.
"TUTORIAL 47: Flip Chip Bonder for Assembling 3-D MEMS,"
(co-author) FlipChips.com , December, 2004.
"Fabrication of Wafer-Level Nano-Optics," Advanced Packaging, November, 2004, Cover Story, pages 18 - 25.
"The Time Machine and Its Lessons," Advanced Packaging,
August, 2004, page 52.
"Wafer Level Hermetic Cavity Packaging," Advanced Packaging, May, 2004, pages 21 - 24.
"TUTORIAL 41: Hermeticity: much to do about nothing," FlipChips.com , May, 2004.
"TUTORIAL 40: Nano-embossing Reaches Production," FlipChips.com , April, 2004.
"TUTORIAL 37: Too Much Gold Can Be A Bad Thing,"
FlipChips.com , January, 2004.
"Wafer Level Vacuum Cavity Packaging for MEMS, Optronics, and Sensors," IMAPS International Symposium 2003, Boston, MA, November 19, 2003.
"Stretching the Stud Bump: Micro-Posts for Flip Chip Arrays," SMTA Flip Chip '03 Workshop, Boston, MA, June 9, 2003.
"TUTORIAL 31: Survey of Wafer-Level Hermetic Cavity Packages for RF," FlipChips.com , June, 2003.
"Wafer-Level Chip Scale Packaging for RF Applications," IMAPS New England 30th Annual Symposium, Boxborough, MA, May 8, 2003.
"TUTORIAL 29: Micro-Posts: Tall, Slender,Stud Bumps" FlipChips.com , April, 2003.
"TUTORIAL 27: Shaping Gold Ball Bumps," FlipChips.com , February, 2003.
"TUTORIAL 24: Gold Stud Bump Applications," FlipChips.com , November, 2002.
"UPDATE: No-Bump Flip-Die Power Products (UBM)," FlipChips.com , April, 2002.
"UPDATE: Stud Bumping 300mm Wafers (UBM)," FlipChips.com , January, 2002.
"UPDATE: Solder Sphere Jet-Bumping," FlipChips.com , November, 2001.
"Flip Chip Assembly of MEMS and MOEMS," Proc. IMAPS 2001 International Symposium,pp 662 - 665, October, 2001.
"Stud Bump Flip Chip Assembly of MEMS," Proc. SMTA International, October, 2001.
"TUTORIAL: Under-Bump Metallization (UBM)," FlipChips.com , September, 2001.
"TUTORIAL: Flip Chip Interconnection of Detector Arrays," FlipChips.com , July, 2001.
"Stud Bump Flip Chip Assembly of MEMS Motion Sensors," IMAPS New England 28th Annual Symposium, Boxborough, MA, May 8, 2001.
"TUTORIAL: Electroless Ni-Au Flip Chip," FlipChips.com , April, 2001.
"Room Temperature Flip Chip Assembly of CdZnTe Pixel Detector Arrays," (co-author) IMAPS/HDI International, San Jose, California, April 19, 2001.
"Flip Chip for Non-Experts: What You Need to Know," IEEE-CPMT Boston, March 27, 2001.
"TUTORIAL: Stud Bump Flip Chip," FlipChips.com , December, 2000.
"TUTORIAL: Solder Bump Flip Chip," FlipChips.com , November, 2000.
"TUTORIAL: Introduction to Flip Chip," FlipChips.com , October, 2000.
"Pick Your Flip Chip: A Comparison of Flip Chip Methods and
Benefits," Electronics Manufacturing
Engineering, Vol. 15, No. 3, pp. 1 - 4, 3rd Quarter 2000.
"Gearing Up for Flip Chip" (co-author), Solid State Technology, Oct.
1999, pp. 87-93.
"Flip Chip Electronic System Assembly Process and Issues for the
NanoWalker" (co-author), Proc. SPIE 3834, Conference on Microrobotics
and Microassembly, pp. 55-62, Sept. 1999.
"Flip Chip Advantages for Complex Electronics in Microsystems," Proc.
SPIE 3834, Conference on Microrobotics and Microassembly, pp. 48-54, Sept.
1999.
"Bump and Flip, Chip by Chip," Proc. IMAPS New England 26th
Symposium, May 1999.
"Prototyping with Flip Chips," Proc. NEPCON West ’99, Feb.
1999.
"Flip Chip Interconnection of Detector Arrays," Proc. SMTA ’98,
Sept. 1998.
"Bump and Flip Single Chips," Advanced Packaging, pp. 38-42,
Jul/Aug 1998.
"Bump, Dip, Flip: Single Chip," Proc. Surface Mount
International Conference (SMI), Sept. 1997, pp. 535-541.
"Adhesive Flip Chip Assembly Using Plated Bump Chips," Proc.
IEEE International Manufacturing Technology Symposium (IEMT), Oct. 1997, pp.
313-318.
"A Comparison of Flip Chip Bumps," Proc. NEPCON Texas ’97,
pp.121-127.
"Flip Chip Interconnection: Dream or Nightmare?" Proc. of the
Third Workshop on Electronics for LHC Experiments, CERN/LHCC, 1997, pp.
107-111.
"Environmental & Reliability Testing of Conductive Polymer Flip Chip Assemblies" (co-author) IEPC Proceedings, Dallas, Texas, September 1993, pp.
328-342.
